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At the end of its manufacturing process a silicon wafer of diameter D 150 mm thickness δ 1 mm and emissivity

At the end of its manufacturing process, a silicon wafer of diameter D = 150 mm, thickness δ = 1 mm, and emissivity ε = 0.65 is at an initial temperature of Ti = 325°C and is allowed to cool in quiescent, ambient air and large surroundings for which T = Tsur = 25°C.

 

(a) What is the initial rate of cooling?

(b) How long does it take for the wafer to reach a temperature of 50°C? Comment on how the relative effects of convection and radiation vary with time during the cooling process. 

 

Jul 23 2020 View more View Less

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